?華宇電子從MGP Mold到Auto Mold;自T-Mold后,又引進(jìn)國(guó)際先進(jìn)的C-Mold塑封設(shè)備:PMC-2030,可實(shí)現(xiàn)Body Thickness:0.35~0.70mm,Overall height:0.45~1.40mm的制程能力,先進(jìn)制程工藝能力有了新的提升!
C-Mold與T-Mold對(duì)比