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  • Hisemi Electronics formally entered the “automotive chip sealing test” market

Hisemi Electronics formally entered the “automotive chip sealing test” market

On March 31, 2022, organized and hosted by The Department of Economy and Information Technology of Anhui Province and jointly promoted by the Development and Reform Commission of Anhui Province, The Department of Science and Technology of Anhui Province and the Bureau of Economic and Information Technology of Hefei, the “core” and “car” collaborative special matchmaking meeting was successfully held in Hefei Crystal Collection. Chizhou Hisemi Electronic Technology Co., LTD., as a key enterprise in the chip packaging industry in Anhui province, was invited to attend. The provincial government, hefei related leaders, more than 20 provincial automotive industry related O&M, wafer manufacturing enterprises, chip design enterprises, chip packaging enterprises, key universities and related research institutions attended the matchmaking meeting.

(Anhui Province “Core” and “Car” cooperation special matchmaking meeting)

Based on the global automotive chip production capacity investment is relatively conservative, strict technical requirements and other reasons, the wave of core shortage in the automotive industry has continued to this day. At the meeting, Ke Wenbin, deputy director of Anhui Provincial Department of Economy and Information Technology, stressed that to promote the high-quality development of Integrated circuit and automobile industry in Anhui Province, we should effectively create a better industrial ecology, promote mutually beneficial cooperation and work together. Anhui province took the lead in the deployment, leading the coordinated development of the industrial chain with policies, and promoting the acceleration of the linkage between “core” and “vehicle”.

(Address by Ke Wenbin, Deputy Director of Anhui Provincial Department of Economy and Information Technology)

Recently, the “14th Five-year plan” of Anhui Province automobile industry high-quality development plan was released, around the development plan of the automobile industry, Anhui province issued a series of policy combination, focus on solving the “core panic” pain point, clearly put forward during the “14th five-year plan”, will strive to build Anhui into a global intelligent new energy vehicle innovation cluster area, Focus on intelligent vehicle chip technology, promote the allocation of innovative resources between schools and enterprises, break through the blocking points of integrated circuits and the upstream and downstream coordination of the automotive industry chain, and effectively enhance the resilience of the industrial chain and supply chain in the province. Strive to 2025 anhui auto industry output value more than 1 trillion yuan.

(Mou Signing Ceremony)

Mr Peng yong as chairman of chizhou Hisemi, speaking at the meeting stressed that it would fully cooperate with upstream and downstream industry chain coordination requirements, to fully support the “core” “car” industry development, combining the reality of its own, will further expand the company size and capacity, to strengthen their own management, completes the car products import and testing process improvement, improve quality, optimize service levels. Between the oEMS and chip manufacturing enterprises, set up the bridge of sealing and testing, and contribute to the independent development of automobile industry in Anhui province and even the whole country.

At the end of the meeting, organized by the Department of Economy and Information Technology of Anhui Province, Chizhou Hisemi, as a key chip packaging enterprise in the province, signed a memorandum of Cooperation on the industrial chain with integrated circuit design, manufacturing and automobile enterprises in the province on the platform.

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