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TO

Product and service

Product introduction
The abbreviation for Transistor Outline Package, Transistor shape package, is a kind of straight plug package.

Product features
Typically, the transistor shape TO is a plug – in package design. In recent years, surface mount market demand increases, TO packaging also has some progress TO surface mount packaging design.

Application
SOT is one of the most mature industry standard packages used in magnetic induction chips, small appliances, motor drives and other products.

Process characteristics
Refer to or meet JEDEC standards
Customized design lead frame design and multi-specification pad size to meet different customer needs
Green manufacturing, lead-free process

Reliability test standard
The test criteria is zero defects in 77 sampling units
JEDEC Prerequisite: J-STD-20/JESD22-A113
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature/humidity test: 85°C/85% RH, JEDEC 22-A101
Temperature cycle test: -65~150 ℃, JEDEC22-A104
High temperature storage test: 150°C, JEDEC 22-A103
High acceleration stress test: 130°C/85% rh /33.5 PSIA, JEDEC 22-A110/A118

 

序號(hào)外型腳數(shù)塑封體長(zhǎng)
(D)mm
塑封體寬
(E)mm
塑封體厚
(A2)mm
產(chǎn)品總寬
(E1)mm
腳間距
(e)mm
腳寬
( b)mm
腳長(zhǎng)
( L)mm
站高
(A1)mm
最大基島
尺寸mil
最大基島
尺寸um
框架厚度
mm
框架
排列
默認(rèn)
包裝方式
1TO92-3L3L4.10±0.14.70±0.11.57±0.11.270.40-0.5713.00±0.5129×923280×23400.381×50靜電帶
2TO92S3L4.0±0.13.2±0.11.55±0.11.270.35-0.5614.5±0.562×821574×20910.381×50靜電帶
3TO94L4L5.22±0.13.65±0.11.56±0.11.270.40-0.5714.5±0.5152×813861×20650.381×40靜電帶
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