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  • Huayu Electronics appeared at the 2022 World Integrated Circuit Conference

Huayu Electronics appeared at the 2022 World Integrated Circuit Conference

On November 17, the 2022 World Integrated Circuit Conference, co-hosted by the Ministry of Industry and Information Technology and the People’s Government of Anhui Province, was held in Hefei, Anhui Province. Chizhou Huayu Electronic Technology Co., Ltd. appeared at booth E1-0299.

This grand event, with the theme of “win-win cooperation”, released the “2022 World Integrated Circuit Conference “Hefei Initiative”, advocating that the upstream and downstream leading enterprises of the global integrated circuit industry chain jointly maintain the resilience and stability of the global integrated circuit industry chain supply chain, condense more consensus, expand pragmatic cooperation, and promote the development of the global integrated circuit industry to be more “brilliant”.

Huayu Electronics based on the semiconductor packaging and testing industry chain, hard work, formed with Huayu characteristics of the packaging and testing industry chain, in recent years, the company continues to innovate independently, from Low pin count to High pin count packaging and testing, from traditional packaging to advanced packaging, with mature SiP development and design capabilities, can provide customers with SiP integrated packaging and testing solutions.

On November 18, at the Sino-Korean Semiconductor Industry Cooperation and Innovation Forum, the chairman of the company, the chairman of the Chizhou Semiconductor Industry Association, made a report on the development of the semiconductor industry in Chizhou City, the development of the semiconductor industry in Chizhou City has been grinding a sword for ten years, a semiconductor industry park with an annual output value of more than 10 billion yuan, it took only 10 years to start from scratch, in the future, it is necessary to expand the terminal industry represented by new displays and 5G applications, and build a “3+2” characteristic development pattern of the semiconductor industry. Actively integrate into the province’s new energy vehicle industry chain, and actively build a manufacturing base for automotive-grade chips and automotive display materials in the province.

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