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  • Chizhou HISEMI Electronics phase III IC packaging base project started !

Chizhou HISEMI Electronics phase III IC packaging base project started !

At 9:28 on The morning of December 15, Chizhou HISEMI Electronic Technology Co., LTD. Phase III project was held.

The chairman of the board and the contractor took a group photo

The total investment of the third phase project is 1 billion yuan, with a total construction area of 45,000 square meters. After the project reaches the stage, the annual sales will reach 2.5 billion yuan, making the company step into the ranks of advanced packaging in a real sense. The packaging technology will upgrade to SIP system-level 3D packaging technology, LGA and BGA advanced packaging technology, and it is expected to be put into production in 2022.

Group photo on site

In the future, the company will develop into a world-renowned semiconductor packaging and testing enterprise, continue to innovate, and strive to make Hisemi Electronics leap into the world’s top 10 semiconductor packaging and testing industry, holding the enterprise mission of “Huayu Xin, the dream of a powerful country”. Congratulations on the successful commencement ceremony of the third phase of the company’s project, and wish the company a successful completion of the third phase of the project!

Phase III – effect drawing of advanced Packaging and testing Industrial base

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