Chizhou HISEMI Electronics phase III IC packaging base project started !
At 9:28 on The morning of December 15, Chizhou HISEMI Electronic Technology Co., LTD. Phase III project was held. The total investment of the third phase project is 1 billion yuan, with a total construction area of 45,000 square meters. After the project reaches the stage, the annual sales will reach 2.5 billion yuan, making …
Chizhou HISEMI Electronics phase III IC packaging base project started ! Read More »